Original papers in, but not limited to the following areas are invited:
1.1 HW/SW co-design, co-simulation and co-verification
1.2 System-level design exploration, synthesis, and optimization
1.3 System-level formal verification
1.4 System-level modeling, simulation and validation
1.5 Networks-on-chip and NoC-based system design
1.6 Constructing Hardware in Scala Embedded Language
2.1 Storage system and memory architecture
2.2 On-chip memory architectures and management: Scratchpads, compiler, controlled memories, etc.
2.3 Memory/storage hierarchies and management for emerging memory technologies
2.4 Near-memory and in-memory computing
3.1 Analog/mixed-signal/RF synthesis
3.2 Analog layout, verification, and simulation techniques
3.3 High-frequency electromagnetic simulation of circuit
3.4 Mixed-signal design consideration
4.1 Digital Simulation / Emulation
4.2 High-Level Synthesis
4.3 Logic Synthesis
4.4 Synthesis for Approximate Computing
5.1 Deterministic/statistical timing analysis and optimization
5.2 Process technology modeling for timing analysis
5.3 Power modeling, analysis and simulation
5.4 Low-power design and optimization at circuit and system levels
5.5 Thermal aware design and dynamic thermal management
5.6 Energy harvesting and battery management
6.1 Floorplanning, partitioning, placement and routing optimization
6.2 Interconnect planning and synthesis
6.3 Clock network synthesis
6.4 Physical design of 3D/2. 5D IC and package ( e. g. , TSV, interposer, monolithic)
6.5 Post layout and post-silicon optimization
6.6 Layout Verification
7.1 RTL and gate-leveling modeling, simulation, and verification
7.2 Circuit-level formal verification
7.3 ATPG, BIST and DFT
7.4 System test and 3D IC test, online test and fault tolerance
7.5 Memory test and repair
8.1 Design-technology co-optimization (DTCO)
8.2 Standard and custom cell design and optimization
8.3 Reticle enhancement, lithography-related design optimizations and design rule checking
8.4 Design for manufacturability, yield, defect tolerance, cost issues, and DFM impact
8.5 Device-, gate, and circuit-level techniques for reliability analysis and optimization (e.g., soft error, aging, etc.)
8.6 Post-Layout optimizations
9.1 Extraction, TSV, and package modeling
9.2 Chiplet Design and Design tools
9.3 Chip Level Thermal Simulation
9.4 Packaging Stress Analysis
9.5 Multi-Physics Simulation
9.6 Signal/Power integrity, EM modeling and analysis
10.1 Device Compact Modeling
10.2 Process Design Kit
10.3 Semiconductor Process & Device Simulation
10.4 Cell Library Design, Characterization and Verification
10.5 New transistor/device and process technology: spintronic, phase-change, single-electron, 2D materials, etc.
11.1 Biomedical, biochip, nanotechnology, MEMS
11.2 Design automation for 3D ICs and heterogeneous integration
11.3 Design automation for quantum computing
11.4 Design automation for silicon photonics
11.5 Design automation for compound semiconductors verification
12.1 Artificial Intelligence for EDA
12.2 Cloud / Parallel Computing for EDA
12.3 Open Source EDA
12.4 EDA Database
12.5 EDA Standardization